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后固化对树脂传递模塑成型复合材料性能影响监测 被引量:3

Monitoring the effect of post-cure on the performance of RTM processing composites
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摘要 研制了双光纤Bragg光栅(FBG)温度/应变传感器,监测二次后固化对树脂传递模塑(RTM)成型复合材料的应变自由温度、玻璃化转变温度、残余应变及热膨胀系数的影响规律,并分析模具材料对热膨胀系数的影响。实验结果表明,二次后固化后,复合材料应变自由温度和玻璃化转变温度分别从189.0℃、189.4℃增加到200.2℃、204.0℃;外层残余应变从-597.7με下降至-671.5με;外层复合材料热膨胀系数从5.248×10-6/℃下降为4.275×10-6/℃,说明后固化可显著提高复合材料性能。 The performance of composites manufactured by resin transfer molding(RTM) processing can be monitored by fiber Bragg grating(FBG) sensor during post-curing procedure.The effects of post-curing on the strain free temperature,glass transition temperature,residual strain,coefficient of thermal expansion of the composites are monitored by the temperature/strain double-FBG sensors.The effect of mould material on the coefficient of thermal expansion is also discussed.The test results indicate that the strain free temperature and the glass transition temperature change from 189.0 ℃ and 189.4 ℃ to 200.2 ℃ and 204.0 ℃,respectively,the outer residual strain changes from-597.7 με to-671.5 με,the outer coefficient of thermal expansion changes from 5.248×10^-6/℃ to 4.275×10^-6/℃ after the post-curing process.Therefore,post-cure can improve the performance of composites.
出处 《光电子.激光》 EI CAS CSCD 北大核心 2012年第6期1120-1125,共6页 Journal of Optoelectronics·Laser
基金 国防基础科研(A352010006) 航空科学基金(2009ZA54001) 中国博士后基金(20090450882) 沈阳科学计划(F11-237-1-00 F11-264-1-26) 辽宁省高等学校优秀人才支持计划(LJQ2011018)资助项目
关键词 树脂传递模塑(RTM) 后固化 光纤Bragg光栅(FBG)传感器 应变自由温度 玻璃化转变温度 残余应变 热膨胀系数 resin transfer molding(RTM) post-cure fiber Bragg grating(FBG) sensor strain free temperature glass transition temperature residual strain coefficient of thermal expansion
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  • 1王岩,李树茂,景磊,张建鑫.T800碳纤维/环氧复合材料老化性能研究[J].纤维复合材料,2020(2):12-15. 被引量:10
  • 2游敏,郑小玲,郑勇,余海洲.树脂基复合材料内应力测试与分析[J].复合材料学报,2004,21(4):29-32. 被引量:7
  • 3李左江,贺福.用动态法研究AG-80/DDS体系的固化过程和加压时机[J].玻璃钢/复合材料,1995(6):19-21. 被引量:2
  • 4栗晓飞,张琦,谢国君,许俊华,肖文萍.影响碳纤维增强树脂基复合材料腐蚀重要环境因素的研究[J].装备环境工程,2005,2(6):34-40. 被引量:16
  • 5Hardis R, Jessop J L P, Peters F E, et al. Cure kinetics characterization and monitoring of an epoxy resin using DSC, Raman spectroscopy, and DEA[J]. Composites Part A: Applied Science and Manufacturing, 2013, 49:100-108.
  • 6Cossins S, Connell M, Cross B, et al. Itt situ near-IR cure monitoring of a model epoxy matrix composite [J]. Applied Spectroscopy, 1996, 50(7) : 900-905.
  • 7Choi J H, Kim I Y, Lee D G. Development of the simple dielectric sensor for the cure monitoring of the high temperature composites [J]. Journal of Materials Processing Technology, 2003, 132(1 3): 168-176.
  • 8Liu C W, Zhao X G, Yu X H, el al. A study of the thermal cure of new trifunctional phenylethynyl terminated imide oligomers with reduced cure temperatures[J]. Polymer Degradation and Stability, 2013, 98(1): 230-240.
  • 9Leprince J G, Hadis M, Shortall A C, et al. Photoinitiator type and applicability of exposure reciprocity law in filled and unfilled photoactive resins[J]. Dental Materials, 2011, 27(2): 157- 164.
  • 10Ito Y, Minakuchi S, Mizutani T, et al. Cure monitoring of carbon-epoxy composites by optical fiber-based distributed strain- temperature sensing system[J]. Advanced Composite Materials, 2012, 21(3): 259-271.

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