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高亮度LED芯片的反射型电流阻挡层设计与实现 被引量:8

Design and realization of reflective current barrier for high-brightness LED chips
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摘要 基于光学传输理论矩阵,设计制作SiO2和Ti3O5交替生长的分布式布拉格反射(DBR)结构作为LED芯片的电流阻挡层,并采用电感耦合等离子体(ICP)刻蚀技术在电流阻挡层处形成沟槽结构,以解决困扰LED器件效率提高的电流扩散及金属电极降低出光效率的问题。实验结果表明,采用这种结构的LED芯片能将亮度提高5%以上,而LED芯片的正向电压基本维持不变。这种反射型电流阻挡层结构能够很好地改善大尺寸LED芯片的电流扩散,有效地提高LED芯片的出光效率。 Based on optical transfer matrix theory,a distributed Bragg reflector(DBR) consisting of SiO2 and Ti3O5 is designed as the current barrier layer for high-brightness LED chips,and a trench structure is etched by inductively coupled plasma(ICP) technique at the current barrier.The problems that the current spreading restricts the improvement of the LED efficiency and the metal electrodes reduce light-extraction efficiency are solved by this way.The experiment results indicate that the brightness of the LED chip with this structure can be increased by 5%,while the chip voltage is essentially unchanged,which shows that the new structure can greatly ameliorate the current spreading and increase the extraction efficiency of LED chip.
出处 《光电子.激光》 EI CAS CSCD 北大核心 2012年第6期1077-1081,共5页 Journal of Optoelectronics·Laser
基金 广东省重大科技专项计划(2009A080301013 2010A080402009) 广东省战略性新兴产业发展LED专项资金(2010A081002009 2011A081301004) 中央高校基本科研业务费专项基金(2011ZZ0017) 广州市重大科技专项(2010U1-D00221 2011Y5-00006)资助项目
关键词 LED芯片 出光效率 电流扩散 电流阻挡层 分布式布拉格反射(DBR) LED chip light-extraction efficiency current spreading current barrier distributed Bragg reflector(DBR)
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  • 1Tawara T,Gotoh H,Akasaka T,et al. Low-threshold lasing of InGaN vertical-cavity surface-emitting lasers with dielectirc distributed Bragg reflectors[J]. Appl Phys Lett,2003,83(5) :830-832.
  • 2Feltin E,Butte R,Carlin J F,et al. Lattice-matched distributed Bragg reflectors for nitride-based vertical cavity surface emitting lasers[J]. Electron Lett,2005,41(2) :94-95.
  • 3Huang G S,Lu T C,Yao H H,et al. Crack-free GaN/AlN distributed Bragg reflectors incorporated with GaN/AIN superlattices grown by metalorganic chemical vapor deposition[J]. Appl Phys Lett,2006,85 (6) :0619041-0619043.
  • 4Diagne M,He Y,Zhou H,et al. Vertical cavity violet light emitting diode incorporating an aluminum gallium nitride distributed Bragg mirror and a tunnel junction[J]. Appl Phys Lett,2001,79(22) :3720-3722.
  • 5Mitrofanov O,Schmult S,Manfra M J,et al. High-reflectivity ultraviolet AlGaN/AlGaN distributed Bragg reflectors[J]. Appl Phys Lett, 2006, 88(17) :1711011-1711013.
  • 6Wang S O,Lu T C,Kao C O,et al. Optically pumped GaN-based vertical cavity surface emitting lasers:technology and characteristics[J]. Jpn J Appl Phys,200? ,46(8B):5397-5407.
  • 7Yao H H,Lin C F,Kuo H C,et al. MOCVD growth of AlN/GaN DBR structures under various ambient conditions[J]. J Cryst Growth,2004, 262 : 151-156.
  • 8Schenk H P D,Mierry P de,Vennegues P,et al. In situ growth monitoring of distributed GaN-AlGaN Bragg reflectors by metalorganic vapor phase epitaxy[J]. Appl Phys Lett,2002,80(2) :174-]76.
  • 9Harutyunyan V S,Aivazyan A P,Weber E R,et al. High-resolution x- ray diffraction strain-stress analysis of GaN/sapphire heterostructures[J]. J Phys D:Appl Phys,2001,34:A35-A39.
  • 10Ive T,Brandt O, Ploog K H. Conductive and crack-free AIN/GaN: Si distributed Bragg reflectors grown on 6H-SiC(0 0 0 1)[J]. J Cryst Growth,2005,278:355-360.

共引文献18

同被引文献63

  • 1吴艳艳,冯士维,乔彦斌,魏光华,张建伟.电流拥挤效应与LED器件可靠性分析[J].发光学报,2013,34(8):1051-1056. 被引量:6
  • 2胡金勇,黄华茂,王洪,胡晓龙.ITO表面粗化提高GaN基LED芯片出光效率[J].发光学报,2014,35(5):613-617. 被引量:8
  • 3康香宁,章蓓,胡成余,王琦,陈志忠,张国义.高反射率p-GaN欧姆接触电极[J].发光学报,2006,27(1):75-79. 被引量:5
  • 4彭鹏,郑洁,周玉礼,朱磊.顶部采光的节能分析[J].照明工程学报,2007,18(1):9-12. 被引量:8
  • 5马新慧.自然光光导照明在建筑采光中的应用[J].建筑电气,2007,26(4):15-18. 被引量:25
  • 6CHANG S J,SHEN C F,CHEN W S,et al.Nitride-based LEDs with an insulating SiO2 layer underneath p-pad electrodes [J].Electrochemical and Solid-State Letters,2007,10(6):H175-H177.
  • 7LEE C M,CHUO C C,LIU Y C,et al.InGaNGaN MQW LEDs with current blocking layer formed by selec-tive activation [J].IEEE Electron Device Letters,2004,25(6):384.
  • 8CHANG C S,CHANG S J,SU Y K,et al.Nitride based power chip with indium-tin-oxide p-contact and A1 back-side reflector [J].Japanese Journal of Applied Physics,2005,44(4S):2462-2464.
  • 9KAO C C,SU Y K,LIN C L.Enhancement of light output power of GaN-based light-emitting diodes by a reflective current blocking layer [J].IEEE Photonics Technology Letters,2011,23(14):986-988.
  • 10Y K Park, J Y Joo, C B Lee, et al.. Design and fabrication of a light emitting diode-based diffuser sheet-less light guide plate for lighting applications [J]. International Journal of Precision Engineering and Manufacturing, 2013, 14(6): 1017-1022.

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