摘要
采用端乙烯基硅油、含氢硅油为基料,氧化铝为导热填料,氢氧化铝为阻燃剂,乙烯基三甲氧基硅烷及γ-甲基丙烯酰氧基丙基三甲氧基硅烷的混合物为偶联剂,铂配合物为催化剂,三羟甲基丙烷二烯丙酯、γ-环氧丙氧丙基三甲氧基硅烷及正硅酸乙酯的反应产物作增粘剂,制备了双组分加成型阻燃导热有机硅电子灌封胶。结果表明,较佳配方为:100份端乙烯基硅油、8份含氢硅油(活性氢质量分数0.25%)、铂的质量分数15×10-6、0.05份抑制剂、150份氧化铝、30份氢氧化铝、0.5份偶联剂、3份增粘剂,所得灌封胶无需底涂剂、在90℃的加热条件下可对PC和铝材等有良好的粘接性,热导率0.8W/m.K,阻燃等级UL94V-0,能够满足大功率电子元器件的灌封要求。
Two-part addition curable silicone encapsulants with flame-retardancy and thermal conductivity were prepared with vinyl silicone oil and hydrogen containing silicone oil as the matrix,Al2O3 as the thermal conductive filler,polyorganohydridosiloxane as the crosslinker,ATH as the flame-retardant and platinum complex as the catalyst,and the reaction products of trimethylolpropane diallyl,γ-glycidoxypropyltrimethoxysilane and TEOS as the adhesion promoters.The results showed that the proper formulation as followed： vinyl silicone oil 100 pbw,polyorganohydridosiloxane（active hydrogen content 0.25%）8 pbw,platinum catalyst 15 ppm,inhibitor 0.05 pbw,Al2O3 150 pbw,ATH 30 pbw,coupling agent 0.5 pbw,and adhesion promoter 3 pbw.The results showed that the encapsulant possessed excellent adhesion on PC and aluminum based materials at 90 ℃ without adhesion promoter with thermal conductivity 0.8 W/mk,and flame retardant grade UL94V-0.The formulation could meet the requirements of the encapsulants for high power electronic components.
出处
《有机硅材料》
CAS
2012年第2期83-86,共4页
Silicone Material
关键词
自粘性
加成型
导热
阻燃
灌封胶
有机硅
self-adhesive
addition curable
thermal conductive
flame retardant
encapsulant
silicone
