期刊文献+

红外焦平面探测器数字读出电路研究 被引量:19

Study on Digital Readout Circuit for Infrared FPA Detectors
在线阅读 下载PDF
导出
摘要 读出电路是红外焦平面探测器组件的重要组成部分,其性能对探测器乃至整个红外成像系统的性能有重大影响。随着硅CMOS工艺的发展,数字化读出电路以及读出电路片上数字信号处理等功能得以实现,能够大幅度提高红外焦平面探测器的性能。以红外焦平面探测器对读出电路的要求入手,分析了读出电路各性能参数对红外焦平面探测器性能的影响,介绍了读出电路的数字化技术及各种实现方式以及数字积分技术。CMOS技术的发展使得数字积分技术在红外焦平面探测器读出电路中得以实现,有效解决了读出电路的电荷存储容量不足的问题,极大地提高了探测器性能。 The readout integrated circuit (ROIC) is an important component for an infrared focal plane array detector, SO its performance will largely affect the performance of the detector or even the whole imaging system. With the development of the silicon CMOS technologies, it is possible to digitize the signal and incorporate digital signal processing inside the ROIC. As a result, the performance of the IRFPA will be improved greatly. Based on the requirements of the IRFPA to ROIC, the influences of the ROIC to the IRFPA performance are analyzed. The digital ROIC techniques and digital integration techniques are introduced. The development of the CMOS technologies enables the digital integration technique, solving the problem of limited charge storage capacity and improving the IRFPA performance greatly.
机构地区 昆明物理研究所
出处 《红外技术》 CSCD 北大核心 2012年第3期125-133,共9页 Infrared Technology
基金 云南省高层次科技人才培引工程资助项目(编号:2011CI136)
关键词 红外焦平面探测器读出电路 模拟-数字转换器 数字读出 数字积分 infrared focal plane array detector readout circuit, analog to digital convertor, digital readout, digital integration
  • 相关文献

参考文献25

  • 1Hsieh C C,Wu C Y,Jih F W,et al.Focal-plane arrays and CMOS readouttechniques of infrared imaging systems[C]//IEEE Trans.on Circuits andSystems for Video Tech.,1997,7:594-605.
  • 2Rosbeck J P,Starr R E,Price S L,et al.Background and temperaturedependent current-voltage characteractics of HgCdTe photodiodes[J].Appl.Phys.,1982,53:6430-6440.
  • 3Pelgrom M J,Duinmaijer A C J,Welbers A P.Matching properties ofMOS transistors[J].IEEE Solid-State Circuits,1989,24:1433-1440.
  • 4Yoon N,Kim B,Lee H C,et al.High injection efficiency readout circuitfor low resistance infra-red detector[J].IEE Electronics Letters,1999,35(18):1507-1508.
  • 5Bluzer N,Stehlik R.Buffered direct injection of photocurrents into chargecoupled devices[J].IEEE Trans.Electron Devices,1978,25(2):160–166.
  • 6Fowler A M,Probst R G,Britt J P et al.Evaluation of an indiumantimonide hybrid focal plane array for ground-based infraredastronomy[J].Opt.Eng.,1987,26:232–240,.
  • 7Kozlowski L,Cabelli S,Kezer R,et al.10×132 CMOS/CCD readout with25 m pitch and on-chip signal processing including CDS and TDI[C]//Proc.SPIE in Infrared Readout Electronics,1992,1684:222–230.
  • 8Hsieh C-C,Wu C Y,Sun T P,et al.High-performance CMOS bufferedgate modulation input(BGMI)readout circuits for IR FPA[J].IEEESolid-State Circuits,1998,33:1188-1198.
  • 9Kulah H.,Akin T.A current mirroring integration based readout circuitfor high performance infrared FPA applications[J].IEEE Trans.Circuits Syst.II,2003,50(4):181-186.
  • 10Kang S G,Woo D H,Lee H C.Multiple integration method for a highsignal-to-noise ratio readout integrated circuit.[J].IEEE Trans.CircuitsSyst.II,2005,52(9):299-302.

同被引文献138

引证文献19

二级引证文献113

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部