摘要
根据导热有机硅封装胶的研发要求,着重介绍了近年来国内外为提高导热有机硅封装胶的耐老化性、导热性、力学性能等方面的最新研究成果,并对有机硅封装胶研发过程中的难点进行了分析,认为寻求高导热填料以及开发新型耐高温有机硅基体材料是导热有机硅封装胶的研发关键。
With the development of photoconducting technology and device produces more heat,there is new requirement of thermal conductivity encapsulation material.The conductive encapsulated silicone was introduced.The research of aging mechanism of silicone,thermal conductive,mechanical properties and encapsulation technology were also expatiated,it analyzed the difficulties during the research.The key of research and development was to seek high thermal conductivity fillers and synthetize novel high temperature resistance silicone material.
出处
《化工新型材料》
CAS
CSCD
北大核心
2012年第3期1-3,17,共4页
New Chemical Materials
关键词
有机硅
胶粘剂
导热性
封装
silicone
adhesive
thermal conductivity
encapsulation
