摘要
介绍了硅抛光片在硅材料产业中的定位和市场情况,化学机械抛光(CMP)技术的特点,硅抛光片大尺寸化技术问题和发展趋势,以及硅抛光片技术指标,清洗工艺组合情况等。
The following situations are introduced in this paper： the orientation and market situation of polished silicon wafer in silicon material industry, the features of chemical mechanical polishing （CMP） technology, technical problems of large size polished silicon wafer and its development trend, as wall as the technical index of polished silicon wafer, cleaning process combination etc.
出处
《云南冶金》
2012年第1期40-44,共5页
Yunnan Metallurgy
关键词
硅抛光片
CMP技术
清洗
polished silicon wafer
CMP technology
cleaning
