摘要
In this paper,thermoelastic damping （TED） in a micro-beam resonator with a pair of piezoelectric layers bonded on its upper and lower surfaces is investigated.Equation of motion is derived and the thermoelasticity equation is governed using two dimensional non-Fourier heat conduction model based on continuum theory frame.Applying Galerkin discretization method and complex-frequency approach to solve the equations of coupled thermoelasticity,we study TED of a clamped-clamped micro-beam resonator.The presented results demonstrate that thickness of the piezoelectric layers and application of DC voltage to them can affect the TED ratio and the critical thickness value of the resonator.
In this paper,thermoelastic damping （TED） in a micro-beam resonator with a pair of piezoelectric layers bonded on its upper and lower surfaces is investigated.Equation of motion is derived and the thermoelasticity equation is governed using two dimensional non-Fourier heat conduction model based on continuum theory frame.Applying Galerkin discretization method and complex-frequency approach to solve the equations of coupled thermoelasticity,we study TED of a clamped-clamped micro-beam resonator.The presented results demonstrate that thickness of the piezoelectric layers and application of DC voltage to them can affect the TED ratio and the critical thickness value of the resonator.
