摘要
从电力机车不等分三段半控桥主电路分析入手 ,对主变流装置半导体元件的温升提出了具体的计算方法 ,给出了计算程序流程图 ,进而提出了主变流装置各桥臂半导体元件的分臂配置方案 ,使半导体元件得到更有效合理的使用。
Starting with the analysis on the main circuit of 3 stage unequal semi controlled bridge of electric locomotive,a specific calcalation method for the temperature rise of semiconductor devices in main converter is presented.Also proposed are the flow chart of the numerical procedure and collocation scheme of semiconductor devices in each bridge arm of the main converter,which is helpful for the efficient and rational application of semiconductors devices .
出处
《机车电传动》
EI
北大核心
2000年第1期17-20,29,共5页
Electric Drive for Locomotives
关键词
电力机车
主电路
主变流装置
半导体元件
温升
electric locomotive
main circuit
main converter
semiconductor device
temperature rise
