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ANSYS在VLSI互连模拟中的应用 被引量：2

Application of ANSYS in the VLSI Interconnect Simulation
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摘要 介绍了ANSYS程序在VLSI互连几何最佳化设计中的初步应用。应用表明:ANSYS的模拟精度高,图形显示功能强。应用ANSYS自动寻优功能使RC延迟最佳化几何参数的寻找较为迅速和直观。 The application of ANSYS to the geometrical optimization of VLSI interconnect is introduced in this paper.Its showed that the auto optimization function of ANSYS can help to rapidly and intuitively seek the optimally geometrical parameters which minimize the RC delay.
作者 阮刚 梁庆龙 ReinhardStreiter 宋任儒 ThomasOtto ThomasGessner
机构地区 复旦大学微电子研究所 Chemnitz技术大学微工艺中心
出处 《半导体技术》 CAS CSCD 北大核心 2000年第1期53-56,共4页 Semiconductor Technology
关键词 集成电路 互连模拟 ANSYS模拟程序 VLSI VLSI Interconnect simulation ANSYS simulated programm
分类号 TN47 [电子电信—微电子学与固体电子学]
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参考文献5

  • 1[1]ANSYS User s Manual for Revision 5.0,Swanson Analysis Systems,Inc.1992
  • 2[2]Mler G,Groth C.FEM Praktiker,expert verlag 1997
  • 3[3]Raphael User s Manual,Technology Modeling Associates,Inc,1994
  • 4[4]Medici User s Manual,Technology Modeling Associates,Inc,1994
  • 5[5]Streiter R,Gessner T,Wolf H.Geometrical optimization of multilevel interconnects using Cu and low-k dielectrics.Micro Electronic Engineering 1997

同被引文献13

  • 1Zhang Wei,Zhu Lian,Sun Qingqing,et al.Synthesis and characterization of SiCOF/a-C:F double layer films with low dielectric constant for copper interconnects[J].Chinese Journal of Semiconductors,2006,27 (3):429-433.
  • 2Semiconductor Industry Association.The International Technology Roadmap for Semiconductor 2005 Edition (ITRS 2005 Edition)[EB/OL].http://www.itrs.net/Common/2005ITRS/Interconnect 2005.pdf,2006-07-15.
  • 3Flannery C M,Murray C,Streiter I,et al.Characterization of thin-film aerogel porosity and stiffness with laser-generated surface acoustic waves[J].Thin Solid Films,2001,388 (1/2):1-4.
  • 4Xiao Xia,Hata N,Yamada K,et al.Mechanical properties of periodic porous silica low-k films determined by the twintransducer surface acoustic wave technique[J].Review of Scientific Instruments,2003,74(2):4539-4541.
  • 5Schneider D,Schwarz T,Scheibe H J,et al.Non-destructive evaluation of diamond-like carbon films by laser induced surface acoustic waves[J].Thin Solid Films,1997,295(1/2):107-116.
  • 6He Johnny H,Le H R,Luo J K,et al.A critical comparison and development of nano-mechanical characterization of MEMS/NEMS thin film materials[C] // Proceedings of SPIE:The International Society for Optical Engineering.USA:International Society for Optical Engineering,2006.
  • 7Jennett N M,Aldrich Smith G,Maxwell A S.Validated measurement of Young's modulus,Poisson ratio,and thickness for thin coatings by combining instrumented nanoindentation and acoustical measurements[J].Journal of Materials Research,2004,19(1):143-148.
  • 8Manghnani Murli H,Tkachev Sergey N,Zinin Pavel V,et al.Elastic properties of nc-TiNa-Si3N4 and nc-TiN/a-BN nanocomposite films by surface Brillouin scattering[J].Journal of Applied Physics,2005,97(5):054308.
  • 9Zhang Feifei,Krishnaswamy S,Dong Fei,et al.Ultrasonic characterization of the mechanical properties of nanostructured diamond-like carbon thin films[C] //Review of Progress in Quantitative Nondestructive Evaluation.USA,2005:1159-1165.
  • 10Xiao Xia,Hata N,Yamada K,et al.Mechanical property determination of thin porous low-k films by twin-transducer laser generated surface acoustic waves[J].Japanese Journal of Applied Physics,2004,43(2):508-513.

引证文献2

二级引证文献6

半导体技术
2000年 第1期

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