摘要
以用于芯片冷却的微型换热器为研究对象,建立三维仿真模型,分析其在热负荷按指数型和周期型变化情况下的瞬态传热。根据获得的换热器温度场、温度梯度和热应力分布,比较了纯铜和氮化硅复合物两种材质对换热器的散热性能,结果表明:铜优良的导热性能使得铜换热器在稳态工况下散热性能优于复合材质换热器,但瞬态分析显示,氮氧化硅复合物在结构强度方面的优势利于换热器长期稳定工作在波动幅度较大的负荷下,很具有吸引力。本文工作对于微型换热器进一步研发具有参考价值。
The research object is a micro heat exchanger （MHT） used for chip cooling, a three dimensional simulation model is developed to analyze the transient heat transfer of such a heat exchanger according to both exponential and periodic heat fluxes. Based on the obtained profiles of temperature, temperature gradient, and thermal stress, a comparison of performance between a copper exchanger and a silicon oxynitride compound exchange is given. The results indicate that the cooling capability of a copper heat exchanger is better than that of a compound one due to the excellent thermal conductivity of copper However, in the transient heat transfer analysis, the better structure strength of silicon oxynitride compound makes such a heat exchanger is attractive and guarantees it can stably working under a large fluctuations with a long service life. The efforts of this paper are referable for further research and development of micro heat exchangers.
出处
《压力容器》
北大核心
2011年第9期26-29,36,共5页
Pressure Vessel Technology
基金
上海市优秀青年教师科研专项基金资助项目(slg09001)
关键词
微型换热器
瞬态传热
温度场
热应力
micro heat exchanger
transient heat transfer
temperature field
thermal stress
