摘要
用DTA、TG研究了不同粒度纯Sn和含微量Ga、S、Cu时的Sn在20℃·min-1的持续升温过程中的氧化过程,测定了升温过程中间产物的XRD图.结果表明,随着粒度增大,Sn开始氧化的温度提高.添加0.1%的Ga提高了锡的氧化稳定性,表面生成一层SnO;添加微量Cu对Sn的氧化影响很小;添加0.1%的S时,氧化稳定性降低.氧化过程中,除添加Ga者外,其它无中间产物SnO生成.
The oxidation process of pure tin and tin samples doped by Ga,S and Cu with different particle sizes has been investigated by DTA,TG and XRD methods.Results revealed that 0.1%addition of Ga markedly influenced the oxidation process of tin.In the heating process,SnO which presents as a more compact film formed on the surface of the particles protected the particles from oxidation to certain extent.In the other cases,tin oxidized into SnO2 directively.S addition deteriorated the oxidation process and lowered the oxidation temperature.
出处
《物理化学学报》
SCIE
CAS
CSCD
北大核心
1999年第11期997-1000,共4页
Acta Physico-Chimica Sinica
基金
国家自然科学基金!资助项目(59371022)
