摘要
对于微电子和光电子元器件及其集成电路来讲，固态介质薄膜是一类重要的基础材料。它们的电击穿场强是一个特殊的特性参数。本文从理论上论述了这类薄膜的电击穿场强，并概述了现在所用的测试方法和多位研究者得出的测试结果。此外， 文中还分类提出了这类薄膜内的弱点类型。
ELECTRONIC COMPONENTS & MATERIALS (China), Vol 18, No 6, P 27 30, 33(Dec 1999) In Chinese For microelectronic and photo electronic components, devices and integrated circuits, solid dielectric thin films are important sort of basic materials. Electric breakdown strength of these films is a particular characteristic parameter. In this paper, electric breakdown strength of solid dielectric thin films is discussed theoretically, and the existing measure methods and the data obtained by numerous researchers for these film are represented. Types of failing in the solid dielectric thin films are also discussed. (23 refs.)
出处
《电子元件与材料》
CAS
CSCD
1999年第6期27-30,33,共5页
Electronic Components And Materials
关键词
固态介质薄膜
电击穿场强
基础材料
thin film of solid dielectric
electric breakdown strength
types of failing
