摘要
系统介绍了开路、短路和电参数漂移这三种主要的MLCC失效模式,以及介质层内空洞和电极结瘤、介质层分层、热应力和机械应力引起介质层裂纹、其他微观机理等五种主要的失效机理。针对MLCC的失效分析技术,从生产工艺和使用设计上提出了预防MLCC失效的措施。
Three failure modes of multilayer ceramic capacitor（MLCC）,such as open,short,key electrical parameters excursion,are systematically reported.The related failure mechanisms,including void,electrode nubble,delamination,and crack induced by thermal stress and machine stress,are also described.Finally,failure analysis technologies are discussed for MLCC,and some methods to avoid its failure from the viewpoint of design and produce process are suggested.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第7期72-75,80,共5页
Electronic Components And Materials
关键词
多层瓷介电容器
失效分析
综述
失效模式
失效机理
multilayer ceramic capacitor
failure analysis
review
failure model
failure mechanism
