摘要
随着电子元器件的高度集成化及加工制造工艺手段的不断提高,电子设备功率密度越来越大,对电子设备进行热设计在电子设备设计过程中越来越重要。该文首先介绍了电子设备热设计的层次、研究内容和任务,然后具体介绍了选择冷却方式的准则,并根据准则选取了合理的冷却方式,设计了散热系统结构,并通过数值模拟计算得到了设备内部的热流场和温度分布。结果表明,所选取的冷却方式满足了设备的散热需求,为设备提供了良好的工作环境,为同类产品的热设计提供了理论基础和方法指导。
With the highly integrated of electronic components and processing means to continuously improve manufacturing processes,increasing power of density electronic devices,electronic devices become more and more important in the design process.This paper describes the electronic device-level thermal design,content and tasks,and then introduced specific criteria for the selection of cooling methods,and criteria for selecting a reasonable according to the cooling mode,the design of the cooling system structure,and obtained by numerical simulation of flow fields inside the device and temperature distribution,the results show that the selected cooling equipment to meet the cooling demand for equipment to provide a good working environment,the thermal design of similar products,provides a theoretical basis and method of instruction.
出处
《电子质量》
2011年第6期35-37,共3页
Electronics Quality
关键词
热设计
热流场
温度场
数值模拟
thermal design
heat flow field
temperature field
numerical simulation
