摘要
通过对超声显微成像技术(AMI)检测原理的分析,阐述了AMI在检测片式多层瓷介电容器(ML-CC)裂纹、分层和空洞等内部缺陷方面的具体应用,其检测结果得到了破坏性物理分析(DPA)的验证。此外,还讨论了不同频率的超声波传感器对AMI检测结果的影响,对提高AMI检测结果的准确性具有指导意义。
In this paper,the application of acoustic micro imaging（AMI） in multi-layer ceramic capacitor（MLCC） inspection is described by analyzing the principles of AMI.Meanwhile the internal defects such as delamination,cracks or voids detected by AMI were demonstrated by the destructive physical analysis（DPA）.In addition,the effect of certain transducers with different frequency on the results identified by AMI is discussed,which are helpful for improving the accuracy of the results.
出处
《电子产品可靠性与环境试验》
2011年第2期49-53,共5页
Electronic Product Reliability and Environmental Testing
关键词
超声显微成像
片式多层瓷介电容器
内部缺陷
破坏性物理分析
acoustic micro imaging
multi-layer ceramic capacitor
internal defect
destructive physical analysis.
