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应力梯度对7075铝合金残余应力松弛的影响 被引量:6

Influence of Stress Gradient on Residual Stress Relief of 7075 Aluminum Alloy
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摘要 分别采用淬火强化和表面喷丸强化工艺对7075高强铝合金试样引入结构和表层集中残余应力,研究循环载荷下具有不同残余应力状态的铝合金试样表层残余应力松弛规律。结果表明,淬火引入了单调的表面残余应力和显微硬度,而喷丸引入了表面残余应力梯度和显微硬度梯度。残余应力沿试样厚度方向分布的应力梯度为应力松弛的主要影响因素,可用于表征应力松弛程度。喷丸引入的表层残余应力均匀且梯度大,主要发生应力松弛;而淬火引入非均匀的结构应力且梯度较小,主要发生应力重分布。 Structural stress and surface residual stress were introduced by quenching and shot peening treatment on 7075 aluminum alloy, the residual stress relief under cyclic loading was studied. The results show that quenching introduces monotonic surface residual stress and microhardness, while shot-peening introduces surface residual stress gradient and microhardness gradient. Stress gradient along with the thickness direction has great influence on residual stress relief which could be utilized to characterize the size and rate of stress relief. Great stress relief would occur in the uniform surface residual stress introduced by shot-peening with a great stress gradient. However, stress re-distribution would occur in the non-uniform structural stress introduced by quenching with a low stress gradient.
出处 《热加工工艺》 CSCD 北大核心 2011年第6期8-10,14,共4页 Hot Working Technology
基金 国家重点基础研究发展规划项目973项目(2005CB6237082010CB731703)
关键词 7075铝合金 残余应力 应力松弛 应力梯度 显微硬度 硬度梯度 7075 aluminum alloy residual stress stress relief stress gradient microhardness hardness gradient
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  • 1Smith D J, Farrahi G H, Zhu W X, et al. Experimental measurement and finite element simulation of the interaction between residual stresses and mechanical loading [J]. International Journal of Fatigue, 2001,23:293-302.
  • 2Rao D, Wang D, Chert L, et" al. The effectiveness evaluation of 314L stainless steel vibratory stress relief by dynamic stress [J]. International Journal of Fatigue,2007,29:192-196.
  • 3Zhuang W Z, Halford G R. Investigation of residual stress relaxation under cyclic load [J]. International Journal of Fatigue, 2001, S23 : 31-37.
  • 4Prime M B, Hill M R. Residual stress relief and inhomogeneity in aluminum plate[J]. Sefipta Materiaiia, 2002,46(1): 77-82.
  • 5Zhao T, Jiang Y. Fatigue of 7075-T651 aluminum alloy[J]. Fatigue, 2008,30 : 834-849.
  • 6吴运新,廖凯,张舒原.大规格高强铝厚板淬火实验问题研究[J].热加工工艺,2008,37(6):50-52. 被引量:3
  • 7王宏伟,马晋生,南俊马,何家文.表面微观屈服强度与疲劳极限的关系[J].金属学报,1991,27(5). 被引量:12

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共引文献13

同被引文献46

  • 1方华军,刘理天,任天令.硅基压电多层膜悬臂梁的偏转模型和优化设计[J].传感技术学报,2006,19(05A):1330-1332. 被引量:3
  • 2廖凯.铝合金厚板淬火-预拉伸内应力形成机理及其测试方法研究[D].长沙:中南大学,2011.
  • 3张园园.铝合金厚板淬火过程及预拉伸热-力仿真与实验研究[D].长沙:中南大学,2009.
  • 4高玉魁.超高强度钢喷丸表面残余应力在疲劳过程中的松弛规律[J].材料热处理学报,2007,28(B08):102-105. 被引量:22
  • 5EUAN B, VOLKER N, DOMINIK W, et al. Direct compari- son of stylus and resonant methods {or determining Young's modulus of single and multilayer MEMS cantilevers[J]. Sen- sors and Actuators A= Physical,2011,172(2):440-446.
  • 6DANYLYUK S V, OTT R, PANAITOV G, et al. Alumin ium nitride-niobium multilayers and free standing structuresfor MEMS[J]. Thin Scl:d Films,2006,515(2):489-492.
  • 7YANG E H, YANG S S, YOO S H. A technique for quanti tative determination of the profile of the residual stress along the depth of p+ silicon films[J]. Applied Physics Letters, 1995,67:912-914.
  • 8NIX W D. Mechanical properties of thin films[J]. Metallurgi- cal and Materials Transactions A-Physical Metallurgy and Ma- terial,1989,20(11) :2217-2240.
  • 9THOMPSOM C V,CAREL R. Stress and grain growth in thin films[J]. Journal of the Mechanics and Physics of Solids, 1996,44(5) :657-673.
  • 10KAMIYA S,SATO M,SAKA M,et al. Residual stress distri- bution in the direction of the film normal in thin diamond films [J]. Sensors and Actuators A Physical,2008,86(1):224-229.

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