摘要
在硫代硫酸盐体系(无氰)下电沉积制备了银纳米膜,研究了电流密度对电沉积银纳米膜的电流效率、结合强度、微观形貌、晶粒尺寸、织构及显微硬度的影响。镀液组成为:硝酸银44g/L,硫代硫酸钠220g/L,焦亚硫酸钾44g/L,醋酸铵30g/L,硫代氨基脲0.8g/L。结果表明:在电流密度为0.20～0.35A/dm2时,镀层与基体结合良好,电流效率随电流密度的增大而先增加再减小,(111)晶面的择优取向程度逐渐减弱,(222)晶面织构增强,晶粒尺寸略有增加,显微硬度稍有减小。
Nanocrystalline silver deposits were prepared by electrodeposition in a cyanide-free thiosulfate system.The bath composition is as follows：silver nitrate 44 g/L,sodium thiosulfate 220 g/L,potassium metabisulfite 44 g/L,ammonium acetate 30 g/L,and aminothiourea 0.8 g/L.The effect of current density on current efficiency,adhesion,morphology,grain size,structure and microhardness of Ag film was studied.The results showed that when the current density is increased from 0.20 to 0.35 A/dm^2,the adhesion is good,the current efficiency is increased initially then decreased,the preferential orientation is changed from （111） to （222）,the grain size is increased and the microhardness is decreased slightly.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2011年第4期5-8,共4页
Electroplating & Finishing
基金
国家自然科学基金(50771042)
河南省基础与前沿技术研究计划(092300410064)
河南省科技创新人才计划(104100510005)
河南省高校科技创新人才支持计划(2009HASTIT023)
关键词
银镀层
纳米晶
电流密度
电流效率
形貌
织构
显微硬度
silver deposit
nanocrystalline
current density
current efficiency
morphology
structure
microhardness
