摘要
为了获得不同性能的电子封装焊料,制备了掺杂Sb(锑)的Sn-3.35Ag-0.7Cu无铅焊料合金,并对其密度、杨氏模量、硬度等重要物理性能进行了测定.测得该无铅焊料的密度为7.210 6 g/cm3,杨氏模量为43 GPa,硬度为96.7 N/mm2.实验结果表明,同未掺杂Sn-3.35Ag-0.7Cu焊料合金相比,硬度略有降低,熔点下降不明显,但密度有显著降低,杨氏模量、润湿性有明显的提高.
We prepare of the doped Sb（antimony） of the Sn-3.35Ag-0.7Cu lead-free solder alloy.Its important physical properties were measured： density,Young＇s modulus,hardness and so on.The density is 7.210 6g/cm3,Young＇s modulus is 43GPa,and the hardness is 96.7 N/mm2.The experimental results show that non-doped with Sn-3.35Ag-0.7Cu solder alloys,the hardness slightly lower,the melting points do not drop obviously than that not doped.However,there is a significant reduction in density.Young＇s modulus and wetting p properties are significantly improved.
出处
《哈尔滨理工大学学报》
CAS
北大核心
2011年第1期22-24,共3页
Journal of Harbin University of Science and Technology
基金
黑龙江省自然科学项目(E200809)
关键词
无铅焊料
密度
杨氏模量
硬度
lead-free solder
density
Young modulus
rigidity
