期刊文献+

具有零偏补偿功能的电容式微加速度计接口电路 被引量:5

Interface circuit with zero compensation function for capacitive microaccelerometers
原文传递
导出
摘要 为了实现了电容式传感器和其他信号处理电路之间的接口,提出了一种电容式传感器接口电路。该接口电路基于开关电容技术,采用采样电荷结构,并在其前端读出电路采用采样开关噪声消除技术,在0.35μm 2P-4 M CMOS标准工艺下设计并流片实现,且特别适用于开环或力平衡闭环电容式微加速度计和振动角速度陀螺仪应用。测试结果表明:在1 MHz的采样时钟下,该接口电路取得了约5.35 aF的电容分辨率和约0.173 aF.Hz-1/2的噪声基底。 This paper presents an interface circuit that provides an interface between capacitive MEMS sensors and other signal processing circuits.The interface circuit was based on the switched-capacitor technique,with the sample-charge architecture.The sampling switch KT/C noise elimination technique was used in the front-end readout circuit.The specially designed interface circuit was implemented for applications in open-loop and force-balance close-loop capacitive accelerometers and vibratory rate gyroscopes in a standard 0.35-μm 2P-4M CMOS process.Experimental results indicate that the interface circuit achieves about 5.35 aF of capacitance resolution with a 1 MHz sampling rate and has a rough noise floor of 0.173 aF/rt-Hz@152 Hz at ambient atmosphere.
出处 《清华大学学报(自然科学版)》 EI CAS CSCD 北大核心 2010年第11期1815-1819,共5页 Journal of Tsinghua University(Science and Technology)
基金 国家“十一五”预研项目(5130805020.8)
关键词 微加速度计 接口电路 开关电容 采样电荷 噪声基底 micro-accelerometer interface circuit switch-capacitor sample-charge noise floor
  • 相关文献

参考文献1

二级参考文献5

  • 1Thomson W T. and Dahleh M D. Theory of Vibration with Application[M]. Prentice Hall, 1998, 55 - 93.
  • 2Yang J. Squeeze-film damping for MEMS structures, M S. Dissertation. Massachusetts of the Technology, Cabfidge, 1998, 12- 52.
  • 3Pallas-Areny R and Webster J G, Sensors and Signal Conditioning. J Wiley, 2001, 112- 180.
  • 4Gabrileson T. Mechanical-thermal noise in nficro-machined acoustic and vibration sensors [ J ]. IEEE Transactions Electron Devices,1993, 40:903- 909.
  • 5魏海龙,单光宝,刘建朝.一种高精度微硅加速度计的模态分析与模拟验证[J].微电子学与计算机,2003,20(4):70-72. 被引量:2

共引文献9

同被引文献31

  • 1吉训生,王寿荣.电容式硅微机械加速度计系统的特性研究[J].宇航学报,2005,26(4):446-449. 被引量:10
  • 2Lakdawala H, Fedder G K. Temperature control of CMOS micromachined sensors[C]//15th IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. New York, USA, 2002: 324-327.
  • 3Dimer J P, Lopez C, Prstic S, et al. Evaluation of solid-state temperature control of silicon packages[C]// Proceedings 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems. Piseataway, New York, USA, 2006: 453-457.
  • 4Lee W F, Chart P IC A capacitive-based accelerometer 1C using injection-nulling switch technique[J]. IEEE Transaction on Circuits and Systems-I, 2008, 55(5): 980-989.
  • 5Liu Yuntao, Liu Xiaowei, Yin Liang, Chen Weiping, Wu Qun. CMOS interface circuitry for a closed-loop capacitive MEMS aceeleromete~C]//2009 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS'09). Shenzhen, China, 2009: 510-513.
  • 6Paavola M, Kamarainen M, J~lrvinen J A M, et al. A micropower interface ASIC for a capacitive 3-axis micro- accelerometer[J]. IEEE Journal of Solid-State Circuits, 2009, 44(11): 3193-3208.
  • 7董景新.微惯性仪表-微机械加速度计[M].北京:清华大学出版社,2002..
  • 8Hartzell A L, Shea H R. MEMS reliability [M]. New York: Springer, 2011.
  • 9Harris C M, Piersol A G. Harris' shock and vibration handbook [ M]. New York: McGraw-Hill, 2002.
  • 10Dong P, Li X, Yang H, et al. High-performance monolithic triaxi- al piezoresistive shock accelerometers [ J]. Sensors and Actuators A: Physical, 2008, 141(2) : 339 -346.

引证文献5

二级引证文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部