摘要
对2种大功率LED封装模组的一些性能参数,如正向电压、光通量、相关色温、显色指数和发光效率的热变化特性等进行了实验测试,并进行了相关分析。实验结果表明,大功率LED封装模组的高结温会降低发光效率,过高时会有其他不良影响,因此,需要采用一些有效的散热方法将LED结温控制在合理的范围内。
In this paper,the thermal variation characteristic of some parameters for two high-power LED packaging modules,such as forward voltage,luminous flux,CCT,color rending index（Ra） and luminous efficiency,were analyzed experimentally.The experiment results demonstrated that high junction temperature of high-power LED packaging modules would decrease luminous efficiency and have other adverse impacts.Therefore,some effective heat dissipation methods are needed to control LED junction temperature within the reasonable range.
出处
《桂林电子科技大学学报》
2011年第1期82-86,共5页
Journal of Guilin University of Electronic Technology
关键词
LED
封装模组
结温
发光效率
LED
packaging modules
junction temperature
luminous efficiency
