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多层流延生坯的热压法叠层工艺研究 被引量:3

Thermo-compression Lamination of Multilayered Ceramic Green Tapes
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摘要 流延生坯的叠层是多层陶瓷器件制造过程的一个关键步骤,热压法是最基本的也是目前使用最为广泛的一种叠层技术。本文主要研究了热压参数对叠片层间结合效果和变形程度的影响,结果表明:层间结合效果会随着压力的增大、温度的提高或者保温保压时间的延长而得到提高;正交试验结果显示热压参数对叠片外部变形程度影响的主次关系为:温度>压力>时间。最后,本文分析了多层流延生坯最优热压工艺参数的确定方法。 Lamination of ceramic green tapes is an important process in the manufacturing of multilayer devices and thermo-compression is the most common method used today.Effects of thermo-compression parameters on the bond quality and deformation extent of laminates were studied.The results showed bond quality were improved with the increase of pressure,temperature or holding time.By orthogonal experiment it showed temperature is the dominant factor in effecting on deformation extent,pressure secondly and holding time at last.How to determine the thermo-compression parameters was then described.
出处 《硅酸盐通报》 CAS CSCD 北大核心 2011年第1期34-38,共5页 Bulletin of the Chinese Ceramic Society
关键词 多层陶瓷 流延生坯 热压法叠层 结合效果 变形程度 multilayered ceramic green tapes thermo-compression lamination bond quality deformation extent
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参考文献8

  • 1Mistier R E,Twiname E R. Tape casting theory and practice [ M ]. Westerville:The American Ceramic Society,2000.
  • 2Imanaka Y. Multilayered low temperature cofired ceramics (LTCC) technology [ M ]. New York : Springer Science ,2005.
  • 3今中佳彦.多层低温共烧陶瓷技术[M].詹欣祥,周济译.北京:科学出版社.2010.
  • 4Thomas C K Y, Wang S F, Juan C C. Effect of lamination conditions on sintered properties of glass-ceramic substrates for microelectranic packaging [ J]. Journal of Materials Processing Technology,2004,148(2 ) :165-170.
  • 5Gurauskis J, Sanchez-Herencia A J, Baudin C. Joining green ceramic tapes made from water-based slurries by applying low pressures at ambient temperature [ J ]. Journal of the European Ceramic Society,2005,25 ( 15 ) : 3403-3411.
  • 6Piwonski M A, Roosen A. Low pressure lamination of ceramic green tapes by gluing at room temperature [ J ]. Journal of the European Ceramic Society, 1999,19 ( 2 ) : 263 -270.
  • 7Roesen A. Low-temperature/low-pressure lamination of green ceramic tapes [ J ]. Advanced Engineering Materials,2002,2 ( 6 ) : 374-376.
  • 8Jurkow D, Roguszczak H, Golonka L. Cold chemical lamination of ceramic green tapes [ J ]. Journal of the European Ceramic Society,2009,29 (4) : 703 -709.

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同被引文献47

  • 1Miura N,Nakatou M,Zhuiykov S.Development of NOx sensing devices based on YSZ and oxide electrode aiming for monitoring car exhausts[J].Ceramics International,2004,30(7):1135-1139.
  • 2Akira Kunimoto,Takashi Ono,Masaharu Hasei.NOx sensor[P].United States:USP6773565,2004.
  • 3Afrasiabi A,Saremi M,Kobayashi A.A comparative study on hot corrosion resistance of three types of thermal barrier coatings:YSZ,YSZ+Al2O3 and YSZ/Al2O3[J].Materials Science and Engineering:A.2008,478(1-2):264-269.
  • 4Gurauskis J,Sánchez-Herencia A J,Baudín C.Alumina-zirconia layered ceramics fabricated by stacking water processed green ceramic tapes[J].Journal of the European Ceramic Society,2007,27(2-3):1389-1394.
  • 5Chang Q,Zhang L,Liu X,et al.Preparation of crack-free ZrO2 membrane on Al2O3 support with ZrO2-Al2O3 composite intermediate layers[J].Journal of Membrane Science,2005,250(1-2):105-111.
  • 6Gongora-Rubio M, Soli-Laguna L M, Moffett P J, et al. The util- isation of low temperature co-fired ceramic (LTCC-ML) tech- nology for meso-scale EMS, a simple thermistor based flow sen- sor [ J ]. Sensors and Actuators A, 1999,73 (3) : 215-221.
  • 7Golonka L J. Technology and applications of low temperature cofired ceramic (LTCC) based sensors and microsystems [J]. Bulletin of the Polish Academy of Sciences Technical Scienc- es, 2006,54 (2) : 221-231.
  • 8Jurk6w D, Go|onka L J, Roguszczak H. LTCC gas flow detector [C]//Proceedings of the European Microelectronics and Pack- aging Conference & Exhibition. Finland: Oulu, 2007 : 204-207.
  • 9Thelemann T, Thust H, Hintz M. Using LTCC for microsystems [ J ]. Microelectronics International, 2002,19 (3) : 19-23 (5).
  • 10Kita J, Dziedzic A, Golonka L J, et al. Laser treatment of LTCC for 3D structures and elements [J]. Microelectronics Interna- tional, 2002, 19(3): 14-18(5).

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