摘要
抛光垫是化学机械抛光中的重要组成部分,其磨损均匀性能是影响加工后工件平面度的重要因素。本文比较了具有优化凸起图案的固结磨料抛光垫、凸起均布的固结磨料抛光垫和聚氨酯抛光垫的研磨抛光性能,结果表明:利用优化凸起图案的固结磨料抛光垫加工,可以得到更加优异且稳定的表面质量,材料去除效率远高于聚氨脂抛光垫游离磨料的加工方式。
The polishing pad plays an important role in the chemical mechanical polishing （CMP） process and its wear influences the surface accuracy of the polished wafer. This article compares the polishing performances of different polishing pads , including fixed abrasive pad （FAP） with optimized pattern, FAP with evenly distributed pattern and polyurethane polishing pad using free abrasive grains. The results show that, FAP with optimized pattern leads to excellent and stable surface quality, and its material removal rate is much higher than that of free abrasive polishing.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2010年第6期8-12,共5页
Diamond & Abrasives Engineering
基金
江苏省自然科学基金(BK2010512)
南京航空航天大学基本科研业务费专项科研项目资助(NS2010127)
