摘要
三维多芯片组件系统集成技术具有组装密度、组装效率及性能更高，系统功能更多等优点，是实现电子装备系统集成的有效途径及关键技术。介绍了３ＤＭＣＭ主要结构（埋置型、有源基板型及叠层型）的特点，并对一些应用实例作了说明。
D MCM's are characterized with its higher integration density and efficiency, higher
performances, more functions, etc It is the important technology for and an efficient approach to
the systematic integration of modern electronic equipment The main structures are introduced
and some practical applications are illustrated (3 refs )
出处
《电子元件与材料》
CAS
CSCD
1999年第2期28-30,共3页
Electronic Components And Materials
