摘要
设计了光敏元尺寸１８μｍ×１８μｍ５１２（Ｈ）×５１２（Ｖ）光纤面板耦合ＣＣＤ高帧速摄像器件，帧速为５００帧／ｓ。详细讨论器件多相加压（ＭＰＰ）和常规工作模式的设计，给出了器件设计性能参数。该器件采用２μｍ，双层多晶硅和双层金属工艺制作。
A framing charge coupled device (CCD) with fiber optic window has been developed for high speed imaging. Designed on an eighteen micron square pixel size with 512(H)×512(V) active pixels, the device provides full resolution at 500 frames per second. The essential design of the MPP operation for low light imaging and general operation with antiblooming feature are discussed in detail and the performance parameters of device are given. Fabrication is based on a triple polysilicon burried channel CCD process with two metal layers.
出处
《红外与激光工程》
EI
CSCD
1999年第2期58-61,共4页
Infrared and Laser Engineering
