摘要
本文采用聚合物的共混改性技术和正交设计确定了ＪＨＦ－Ｒ３４高分子合金修补剂的配方。该修补剂弥补了以往环氧胶粘剂不能进行车、钻、削、刨等机械加工的不足之处，因而，ＪＨＦ－Ｒ３４高分子合金修补剂可更广泛地应用于电子、机械、建筑。
Based on the results of orthogonal experiments,JHF-R34 polymer alloy putty is formulated by means of co-blending epoxy resins,PB resin and alloy dusts.The putty can be lathed,drilled,cut and planed,so it can be more widely used as bonding or repairing agents for many materials in industry
出处
《化学与粘合》
CAS
1999年第3期128-131,共4页
Chemistry and Adhesion
