摘要
为了提高微电子线路板(PCB)加工用微型钻头的使用寿命及保证钻孔质量,采用中频反应磁控溅射、离子束辅助的方法分别在WC硬质合金和微型钻头上沉积了Cr/CrN/CrTiAlN/CrTiAlCN多元多层梯度硬质薄膜,研究了多层膜的结构、形貌及钻削性能。结果表明:在WC硬质合金上沉积的多层膜显微硬度为2631HV,膜/基结合力大于80N,摩擦系数为0.113;镀膜后微钻刃型完好,刃型角度没有改变,同一钻头不同部位沉积的膜层厚度一致;微钻镀膜后使用寿命提高1倍以上,且解决了断针、批锋、塞孔等问题,同时满足孔位精度、孔壁粗糙度等技术要求。
Cr/CrN/CrTiAlN/CrTiAlCN multilayer gradient film was prepared on the surface of WC hardalloy and micro-drill by combining medium-frequency reaction magnetron sputtering technique with ion beam assisted deposition technique so as to effectively improve the service life and quality of drilled holes of micro-drills used for processing microelectronic printed circuit boards. The microstructure, morphology and drilling performance of resultant multilayer film were analyzed. Results show that the multilayer film deposited on WC alloy has a micro-hardness of 2 631 HV, adhesion strength of over 80 N and friction coefficient of 0.113. The micro-drill covered with the multilayer film retained an intact blade shape and an unchanged blade angle, while the film was uniform in terms of the thickness. Moreover, the micro-drill deposited with the multilayer film had nearly doubled service life and was free of troubles like broken needles and plugged holes, meeting with the technical requirements for hole position accuracy and hole wall roughness.
出处
《材料保护》
CAS
CSCD
北大核心
2010年第11期67-69,共3页
Materials Protection
基金
广东省技术创新基金资助项目(200503027)
关键词
磁控溅射
多元多层薄膜
微型钻头
钻削性能
magnetron sputtering
multi-component multilayer film
micro-drill
drilling performance
