摘要
本文利用电子扫描电镜，观察了金刚石磨粒的微切削刃以及氧化铝陶瓷试件的磨削表面、已磨削表面，对电镀金刚石砂轮端磨氧化铝陶瓷的机理进行了研究，指出氧化铝陶瓷已磨削表面的缺陷以脆性裂纹为主，磨削温度对材料去除过程影响很大，有可能存在非裂纹扩展的陶瓷材料去除方式。
The microedge of diamond grain, the grinding surface, the ground surface are photographed by scanning electron microscope. The mechanism of grinding aluminum oxide ceramic material with an electroplated diamond wheel is studied. The research results show that the ground surface has a large number of cracks, the grinding temperature has important influence on material removal process, the
出处
《金刚石与磨料磨具工程》
CAS
1999年第2期27-31,共5页
Diamond & Abrasives Engineering
