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内聚力界面单元在胶接接头分层仿真中的应用 被引量:22

The Simulation of The Process of Laminal Damage in the Adhesive Bonded Joint Using the Cohesive Interface Element
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摘要 分层是胶接接头的主要破坏形式,而分层主要发生在胶层与被粘物的界面层上,因此,对胶接接头界面层的力学行为的分析是很有必要的。由于界面层厚度太小,用常规的有限元法或边界元法很难对其进行仿真,更加无法仿真胶接接头的分层损伤过程。针对上述情况,为提高接头结构承载力,采用零厚度的内聚力界面单元来仿真界面层,克服无法仿真界面层的困难,对胶接接头的分层损伤过程进行仿真,并与试验结果进行对比,验证方法的有效性。通过仿真分析结果与试验结果对比可知,仿真分析结果与试验结果吻合较好。因此,运用内聚界面单元仿真界面层方法是有效的,并为复杂胶接接头承载能力分析提供有力的依据。 Laminal damage is a main type of damage in the adhesive bonded joint,and it often occurs in the interface layer of the joint.So,it is necessary to analyze the mechanical action of the interface layer.However,because the thickness of the interface layer is very small,it is difficult to simulate the interface layer by regular finite element method or boundary element method,and it is also difficult to simulate the process of laminal damage.To address this situation,in the paper,we use the cohesive interface element with the thickness of zero to simulate the interface layer to get the rule of laminal damage,and contrast with experimental result to validate the validity of the method.By contrasting with experimental result,we find that the result in the simulation is similar to the result in the experiment.So,the method of using the cohesive interface element to simulate the interface layer is effective,it is useful for carrying capacity's analysis of complex joint.
出处 《计算机仿真》 CSCD 北大核心 2010年第10期317-320,360,共5页 Computer Simulation
关键词 内聚力界面单元 胶接接头 分层损伤 界面层 Cohesive interface element Adhesive bonded joint Laminal damage Interface layer
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  • 1Lang T P, Mallick P K. The effect of recessing on the stresses in adhesively bonded single-lap joints. Int. J of Adhesion & Adhesives, 1999,19:257-271.
  • 2Coelm K W. Adhesion and adhesive fundamentals and practice. London,UK: Soc of Chem Ind. 1961.
  • 3Sheppard A, Kelly D, Tong L. A damage zone model for the failure analysis of adhesively bonded joints. Int J of Adhesion & Adhesives, 1998,18:385-400.
  • 4Dom L, Liu W. The stress state and failure properties of adhesively-bonded plastic/metal joints. Int J of Adhesion & Adhesives, 1993, 13 ( 1 ) : 21 -31.
  • 5Li G, Lee-Sttllivan P. Finite element and experimental studies on single-lap balanced joints in tension. Int. J of Adhesion & Adhesives, 2001, 21:211-220.
  • 6You M, Zheng Y, Zheng X L, Liu W J. Effect of metal as part of fillets on the tensile shear strength of adhesively bonded single lap joints. Int J of Adhesion & Adhesives, 2003,23: 365 - 369.
  • 7晏石林,武汉工业大学学报,1988年,10卷,1期,31页
  • 8李春植,戴瑞玲,王玮.粘接点焊单搭接头的静力分析[J].机械强度,1997,19(2):21-24. 被引量:5
  • 9何平笙.关于《高聚物的结构与性能》课的教学主线[J].高分子通报,1997(2):122-124. 被引量:16
  • 10常保华,史耀武,董仕节.胶粘剂厚度和弹性模量对胶焊接头应力分布的影响[J].材料工程,1998,26(5):19-23. 被引量:15

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