摘要
低Ag（Ag含量〈1%,质量分数,下同）的SAC无铅钎料存在润湿性和可靠性不足的问题。为探索解决这些问题,研究了Ag含量、Ni和Bi等合金元素对合金微观组织、润湿性和溶铜性等关键性能的影响。结果表明：Ag含量的变化带来了组织、熔化特征和力学性能的规律性改变;Bi和Ni元素的少量添加能够提高合金的可焊性（润湿性）,并降低合金的铜溶解率;SAC0805BiNi钎料的铜溶解率小于SAC0307和SAC305钎料,而润湿性接近SAC305钎料;Ag含量在0.3%-1%之间的合金韧性更好。因此,适当选择Ag含量和采用合适添加元素,成本相对较低的低银无铅钎料综合性能接近SAC305无铅钎料。
Low-silver（Ag1%,mass fraction） SAC lead-free solder alloys meet wettability and reliability problems.Effect of silver content,nickel and bismuth element additions on some key properties such as microstructures,wettability and copper dissolution property of solder alloys was investigated to seek the possible solution.The results showed that the regular change of microstructures,melting behavior and tensile property of the solder alloys was resulted by the increase of silver content;the additions of bismuth and nickel could improve the solderability（wettability） property of the alloys and lower the copper dissolution rate.It was also found that the copper dissolution rate of SAC0805BiNi solder is lower than SAC0307 and SAC305 solder alloys,and wettability is close to SAC305 alloy.The alloys with silver content between 0.3% and 1% mass percentages exhibit good ductility.Consequently,the overall performance of low cost solder alloys will be approaching to the SAC305 alloys with proper silver content and addition of alloy elements.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2010年第10期100-104,共5页
Journal of Materials Engineering
基金
广州市天河区科技计划项目(095G108)
广州有色金属研究院创新基金(1683018)
关键词
SAC
溶铜性
无铅钎料
润湿性
SAC
copper dissolution
lead-free solder
wettability
