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炭黑填充PE-HD/EVA/PE-LD导电发泡复合材料的阻温特性 被引量:4

Resistivity-temperature Behavior of Acetylene Carbon Black Filled PE-HD/EVA/PE-LD Conductive Foamed Composites
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摘要 以高密度聚乙烯(PE-HD)为聚合物基体材料、乙烯-乙酸乙烯酯(EVA)为增韧剂、低密度聚乙烯(PE-LD)为增塑剂、乙炔炭黑(ACET)为导电填料、偶氮二甲酰胺(AC)为发泡剂、过氧化二异丙苯(DCP)为交联剂制备了PE-HD/EVA/PE-LD/ACET导电发泡复合材料。结果表明,PE-HD/EVA/PE-LD=50/30/20(质量比,下同)、ACET填加量为35%(质量分数,下同)、发泡剂AC的添加量为4%、交联剂DCP填加量为0.5%时,制备的导电发泡复合材料具有比较理想的闭孔泡孔结构。经过升温电阻测试,发现PE-HD/EVA/PE-LD/ACET导电发泡复合材料具有良好的开关特性,呈现明显的正温度系数(PTC)特性;AC发泡剂用量为4%时,PTC效应最强。 PE-HD/EVA/PE-LD/ACET conductive foamed composites were prepared using acetylene carbon black (ACET) as a conductive filler, azobisformamide (AC) as a foamer, and dicumyl peroxide(DCP) as a cross-linker. Closed cell structure was obtained when PE-HD/EVA/PE-LD is 50:30:20(w/w/w),and acetylene carbon black, azobisformamide, and dicumyl peroxide content were 35, 4, and 0.5 wt %, respectively. The prepared conductive foam composites had good switching characteristics, and displayed positive temperature coefficient (PTC) effect, which was the strongest when the contents of AC was 4 wt %.
出处 《中国塑料》 CAS CSCD 北大核心 2010年第9期49-52,共4页 China Plastics
基金 辽宁省教育厅高等学校A类资助项目(L2010391)
关键词 乙炔炭黑 低密度聚乙烯 乙烯-乙酸乙烯酯 高密度聚乙烯 正温度系数特性 导电发泡复合材料 acetylene carbon black low density polyethylene ethylene-vinyl aceate high-density polyethylene positive temperature coefficient effect conductive foamed composite
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参考文献7

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