摘要
简要介绍氰化和无氰仿金电镀工艺流程、配方成分、工艺条件、后处理和常见问题的处置。
This paper brifly introduced the process, formula composition, technology condition, afterteatment and common problem disposals of cyanic and noncyanic imitative gold plating.
出处
《涂装与电镀》
2010年第5期38-42,32,共6页
Painting and Electroplating
关键词
仿金电镀
焦磷酸盐
HEDP
imitative gold plating
pyrophosphate
HEDP
