摘要
采用多种工艺对比的方法,研究了陶瓷基片化学镀铜工艺及其特点,结果表明:(1)采用化学镀铜的方法可以实现陶瓷基片的金属化;(2)基片表面孔隙的存在对提高膜/基结合力的作用是有限的,为获得结合良好的镀层,仍需对陶瓷基片进行粗化处理;(3)前处理工艺中,须注意强化除油清洗效果以进一步净化表面孔隙;(4)镀液浓度影响镀层的沉积速率及结合力。
Electroless copper plating process and its characteristic on ceramics (aluminum oxide) are studied by comparison among several processes. The results show that ceramic substrate can be metallized by the electroless copper plating method. Because porosity on the ceramic surface can not obviously improve cohesion between film and substrate, it is necessary to coarsen the surface of ceramics. Degreasing must be enhanced in order to clean the porosity. Concentration of plating solution obviously affects the deposition rate and cohesion.
出处
《表面技术》
EI
CAS
CSCD
1999年第3期15-18,共4页
Surface Technology
关键词
氧化铝陶瓷
化学镀
电镀
镀铜
工艺
Aluminum oxide Ceramic substrate Metallize Electroless Copper plating Deposition rate Cohesion between film and substrate
