摘要
采用Ag-Cu-Ti钎料对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空钎焊,并对接头的微观组织和室温强度进行了研究。结果表明,利用Ag-Cu-Ti钎料可以实现SiC与TiAl的连接;接头界面具有明显的层状结构,即由Ti-Cu-Si合金层、富Cu相与富Ag相的双相层和Ti-Al-Cu合金层组成;在1173K和10min的钎焊条件下,接头室温剪切强度达到173MPa。
The vacuum brazing of pressureless - sintered SiC ceramic to TLAl intermetallic compound was carried out by Ag - Cu-Ti brazing filler metal. The microstructures and strength of the joints were investigated. The experimental results showed that the bonding of SiC to TLAl can be accomplished by Ag - Cu - Ti brazing filler metal. Between SiC and TiAl an interfacial structure occurs, that is clearly composed of Ti - Cu - Si alloy layer, Cu - rich and Ag - rich alloy layer and Ti - Al - Cu alloy layer. The shear strength of the joint, which was brazed at 1173 K for 10 min, is up to 173 MPa at room temperature.
出处
《焊接》
1999年第3期7-10,共4页
Welding & Joining
基金
国防科技预研基金
哈工大校管基金
焊接国家重点实验室开放课题资助项目
关键词
陶瓷
TIAL合金
真空钎焊
焊接
碳化硅
SiC ceramic, TiAl alloy, Ag- Cu- Ti brazing filler metal, vacuum brazing, microstructure
