摘要
无铅焊料代替Sn-Pb焊料已成为趋势,润湿性差是无铅焊料难以适应传统回流焊和波峰焊等群焊工艺的主要问题.结合近期研究成果,对无铅焊料的润湿性机制进行了探讨,分析了影响其润湿性的各种因素.
In enormous electronic industry,it is a trend that lead-free solders will be a substitute for Sn-Pb solders.But poor dissolution and wettability are the main problems for lead-free solders to adapt to traditional reflow and wave soldering process.Based on the resent research works,the wettability mechanism of lead-free solders,various influencing factors of wettability were discussed and analysed in detail.
出处
《上海工程技术大学学报》
CAS
2010年第2期163-166,共4页
Journal of Shanghai University of Engineering Science
基金
上海市教委第5期重点学科建设资助项目(J51402)
上海工程技术大学研究生科研创新资助项目(A-0503-10-27)
关键词
无铅焊料
润湿机制
钎焊
lead-free solder
wettability mechanism
brazing and soldering
