摘要
将有机硅单体(D4)与丙烯酸丁酯(BA)、甲基丙烯酸甲酯(MMA)、丙烯腈(AN)和丙烯酸(AA)等单体进行共聚,反应后期再引入乙烯基硅烷偶联剂(A-151)作为交联剂,合成出无甲醛低温自交联型网印粘合剂。分析了D4和A-151的加入顺序和用量对该粘合剂性能的影响。结果表明:采取先D4开环、后期加入A-151的聚合工艺,并且当w(D4)≤6%(相对于单体总量而言)和w(A-151)=3%～5%(相对于单体总量而言)时,粘合剂具有胶膜不易黏连、耐水性优、柔软度佳和摩擦牢度好等特点,并可实现低温(100℃)自交联。
A low-temperature self-crosslinkable screen printing adhesive without formaldehyde was synthesized by copolymerization between organosilicon monomer（D4） and some monomers[such as butyl acrylate（BA）, methyl methacrylate（MMA）,acrylonitrile（AN） and acrylic acid（AA）] and then adding vinyl silane coupler（A-151） as cross linker in later stage of reaction. The influences of contents and adding order of D4 and A-151 on the performances of adhesive were analysed. The results showed that the adhesive with non-adhesion and low- temperature（100 ℃） self-crosslinkable characteristic had well water resistance ,flexible and rubbing fastness when mass fractions of A-151 or Da were 3%-5% or not above 6% in total monomers,and the polymerization process for first opening-ring reaction of D4 and then adding A-151 in later stage of reaction was adopted.
出处
《中国胶粘剂》
CAS
北大核心
2010年第7期45-48,共4页
China Adhesives
关键词
有机硅
无醛
改性
自交联
粘合剂
organosilicon
without formaldehyde
modification
self-crosslinkable
adhesive
