摘要
近年来,LED技术与产业发展迅速,成为半导体制造行业的最大亮点。从技术和产业两个大的方面介绍了国外LED的发展现状、特点和趋势。介绍了产业化的两种衬底外延技术——蓝宝石衬底和SiC衬底,然后介绍了近年来出现的几种芯片技术、几大公司的芯片技术特点、常用的封装技术及其发展趋势目标等,最后介绍了LED器件的实验室水平和商业化生产的水平以及低成本LED的发展,总结了LED的技术发展趋势。产业方面,主要介绍了LED生产线的分布、欧、美、日、韩等国的产业概况、公司封装产值排名及分析,最后总结了产业发展的特点与趋势。
LED technology and industry develop rapidly in recent years.It is becoming the most lighting in semiconductor manufacture.Development trend of foreign white LED is introduced from technology and industry aspects.Two kinds of substrate epitaxy technologies（sapphire and SiC）are presented,several chip technologies,chip features of some famous companies,package technology and the development trends are introduced.The LED status of lab and industry and low cost LED are presented.Technology development trends of LED are discussed.The distribution of LED fabs,industry survey in Europe,America,Japan and Korea and LED makers revenue ranking are described.Finally,the features and trends of the industry are summarized.
出处
《半导体技术》
CAS
CSCD
北大核心
2010年第7期621-625,743,共6页
Semiconductor Technology
关键词
白光LED
LED产业
衬底技术
芯片技术
封装技术
white LED
LED industry
substrate technologies
chip technologies
package technology
