摘要
较传统的焊接方法,回流焊能高效、重复、无/低空洞地进行大面积电路片的焊接。基于PCB板回流焊接技术分析了回流焊大面积薄电路片的影响因素,结果表明影响焊接的主要因素是工艺气氛、压力、温度曲线等。通过对这些因素的控制,可以实现大面积薄电路片无/低空洞焊接,这对提高大的功率产品的可靠性非常有利。此技术将应用于公司大功率产品批量生产中去。
Compared to the traditional method of soldering,reflow is an efficient,repeatable,void free/low technology for large circuit wafers.Based on the PCB reflowing technology,the influencing factors of the large and thin circuit wafers reflowing are analyzed.The conclusion indicates that the major influencing factors are technical air,force,temperature profile and so on.The void free reflowing for large circuit wafers are obtained through controlling these factors,it is benefit for enhancing the reliability of the big power products.The technology will be applyed to mass production.
出处
《半导体技术》
CAS
CSCD
北大核心
2010年第6期577-579,共3页
Semiconductor Technology
关键词
回流焊
空洞
影响因素
可靠性
薄电路片
reflowing
void
influencing factor
reliability
thin circuit wafer
