期刊文献+

聚酰亚胺/有机蒙脱土/丁苯橡胶复合材料性能的研究

Study on Properties of Polyimide/Organically Modified-Montmorillonite/Styrene Butadiene Rubber Composites
在线阅读 下载PDF
导出
摘要 将聚酰亚胺(PI)与有机蒙脱土(OMMT)混合,制备了PI/OMMT粉状材料;将粉状材料与丁苯胶乳(SBR)混合,制备了颗粒状PI/OMMT/SBR复合材料.SEM照片显示,有机蒙脱土可改善聚酰亚胺与丁苯橡胶的相容性.X射线衍射(XRD)结果表明,聚酰亚胺分子链与丁苯橡胶分子链一起插入有机蒙脱土层间,使层间距变大;有机蒙脱土作为交联点存在.动态力学性能测试结果表明,在频率扫描下,加入PI/OMMT后丁苯橡胶的G′最高,但tanδ较低. Polyimide(PI)/ organically modified-montmorillonite(OMMT) powder was prepared by blending PI and OMMT.PI/ OMMT/SBR composite was prepared by blending the powder and SBR latex.SEM analysis indicated that OMMT could promote PI and SBR compatibility.X-ray diffraction(XRD) pattern indicated that the distance between the layers of organically modified-montmorillonite(OMMT) was increased evidently by the intercalation of PI and SBR.The results of dynamic mechanical properties test on PI/OMMT/SBR indicated that the dynamic mechanical properties of SBR were promoted by PI/OMMT.
出处 《特种橡胶制品》 2010年第3期1-4,15,共5页 Special Purpose Rubber Products
基金 国家自然科学基金(10576017)
关键词 聚酰亚胺 有机蒙脱土 丁苯橡胶 插层 复合材料 polyimide organically modified-montmorillonite styrene butadiene rubber intercalation composite
  • 相关文献

参考文献9

二级参考文献105

  • 1什瓦尔茨A.Г 金兹布尔格Ъ.H.橡胶与塑料及合成树脂的并用[M].北京:化学工业出版社,1981.86.
  • 2R J Varley, J H Hodgkin, et al. Toughening of a trifunctional epoxy system Ⅱ Thermal characterization of epoxy/amine cure[J]. J Appl Polym Sci, 1996, 60:2251 -2263.
  • 3N Biolley, T Pascal , B SiUion. Polymide-modified epoxy system: time-temperature-transformation diagram, mechanical and thermal properties [Jl. Polymer, 1994, 35: 558-564.
  • 4Whan Gun Kim, Tae Young Nam. Curing characteristics of ocresol novolac epoxy resin modified by bismaleimide [Jl. J Polym Sci: part A: Polymer Chemistry, 1996, 34: 957-962.
  • 5Reza Bagheri, Raymond A Pearson. The use of microvoids to toughen polymers [Jl. Polymer, 1995, 36: 25. 4883.
  • 6H J Sue, P M Puckett, et al. Structrue and property relationships in model diglycidyl ether of bisphenol-A and diglycidyl ether of tetramethyl bisphenol-A epoxy systems Ⅰ. Mechanical property characterizations [J]. J Polym Sci: Part B: Polymer Physics, 1999, 37: 2137-2149.
  • 7H Wu, A Gopala, et al. Investigation of readily processsable thermoplastic-toughened thermosets Ⅱ. Epoxy thoughened using a reactive solvent approach [J]. J Appl Polym Sci, 1998,70: 935- 942.
  • 8N A Adrova, M 1 Bessonov, et al. Polylmides-A new class of thermally stable polymers (Progress in Materials Science Series Vol Ⅲ ) [M]. Technomic Publishing Co Inc. 1970.
  • 9Jyongsik Jang, Jeung Hoon Lee. Effect of imidization temperature on the adhesion of polyimide on aluminum [J]. J Appl Polym Sci, 1996, 62: 199-205.
  • 10Der-Jang Liaw, Been-Yang Liaw, Chia-Wei Yu. Synthesis and characterizeation of new organosoluble polyinides based on flexible diamine [J]. Polymer, 2001, 42: 5175-5179.

共引文献34

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部