摘要
采用电化学方法，对基板上的Ａｌ膜进行选择性阳极氧化，从而制得导带、通孔和介质，重复上述工序，便可制得多层布线基板。与常用多层布线基板，如ＭＣＭ－Ｃ、ＭＣＭ－Ｄ比较，它具有制作工艺简单独特、互连密度高，线径、间距和孔径更小，平面性好，绝缘电阻高等优点。
Conductive tapes, vias, and dielectric layers can be made by anodize the selected area and multilayer substrates can be acquired by repeating the process Compared with the conventional multilayer substrates, such as MCM C and MCM D, the substrate has following advantages: simpler process, higher interconnections density, higher line definition, better flatness and higher insulated resistance (2 refs )
出处
《电子元件与材料》
CAS
CSCD
1999年第1期15-17,共3页
Electronic Components And Materials
