摘要
采用5种不同粒径的球形硅微粉(2、3、5、10、20μm)进行级配填充制备集成电路(IC)封装用环氧模塑料(EMC),运用经典颗粒堆积理论,计算出符合粒度分布方程Dinger-Funk-Alfred的颗粒分布,使用Matlab软件编程计算出最佳的粒径配比方案。根据计算出的最佳粒径配比,混合填充于邻甲酚醛环氧树脂中,经过混炼后制备出IC封装用EMC,分别用旋转流变仪和毛细管流变仪测定其流变性能。结果表明,不同粒径的硅微粉级配填充到模塑料中可大大提高EMC的流动性。
By means of matching filling of five grades of spherical silica with the particle size of 2 μm, 3 μm, 5μm, 10 μm, and 20μm, respectively, the epoxy molding compounds （EMC） for intergrated circuits（IC） were manufactured. Using classical particle accumulation theory, the particle distribution according with Dinger-Funk-Alfred equation was calculated by Matlab simulation software, and the optimal particle size formulations were obtained. Adding the mixed silica according to the above optimal formulations into epoxy resin, the EMCs were manufactured by twin-roll compounding at 95- 105 ℃. Measurement of rotating and capillary rheometers showed that the matching filling of silica with different particle size could improve the flowability of EMC.
出处
《中国塑料》
CAS
CSCD
北大核心
2010年第3期92-95,共4页
China Plastics
基金
北京市教育委员会科技计划项目(KM200910017008)
广东省关键领域重点突破项目(200649832)
关键词
球形硅微粉
环氧模塑料
级配填充
流动性
spherical silica
epoxy molding compound
matching filling
flowabilitv
