摘要
用电沉积法在纯铜触头表面制备了铜-钨复合镀层。对复合镀层的表面形貌和主要使用性能进行了研究，结果表明：镀层表面组织均匀致密，具有良好的结合强度和适宜的硬度，相对于纯铜镀层而言，复合镀层有较好的抗氧化性能和耐电化学腐蚀性能。在电压12V，电流分别为10、15、20和25A，接触1×100次条件下，复合镀层的接触电阻在10～40mΩ之间波动，可满足一些低压电器的使用要求。用SEM对不同电流下经1×100次电弧侵蚀后的复合镀层进行观测，发现其表面有明显的凹坑、孔洞等形貌特征。
A Cu-W composite coating were electrodeposited on the surface of pure copper contact. The surface morphology and major used properties of the Cu-W composite coating were studied. The results showed that the composite coating has features of uniform and compact structure, good adhesion and appropriate hardness. The oxidation resistance and electrochemical corrosion resistance of the Cu-W composite coating are better than those of pure copper coating. The contact resistance fluctuates in the range of 10 - 40 mΩ under the conditions of voltage 12 V, current 10, 15, 20 and 25 A and contact times 1 × 10^4. It can meet the requirements of some low voltage electrical apparatus. After arc erosion with different currents for 1 × 10^4 contact times, the surface morphology of the composite coating was analyzed by SEM, and some obvious morphological characteristics such as pits and pores were found.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2010年第5期6-8,共3页
Electroplating & Finishing
基金
贵州省科技厅工业攻关项目(Z083076[2008]3030)
贵州大学青年基金项目(X082030[2007]030)
关键词
铜
钨
复合镀层
电沉积
表面形貌
接触电阻
copper
tungsten
composite coating
electrodeposition
surface morphology
contact resistance
