摘要
结合EDA软件Cadence及目前常用的有限元分析软件ANSYS模拟了芯片的瞬态热效应.将从电路仿真软件中得到的电学参数作为ANSYS软件的载荷,加载到从ANSYS中建立的热模型上,对芯片的瞬态工作状态进行了热仿真,模拟芯片工作时的瞬态温度分布.针对一个简单集成电路进行芯片级的瞬态热分析,通过调整热载荷脉冲时间得到了此电路的热时间常数;模拟了同一频率不同占空比下电路的热响应情况;模拟了相同时间、相同占空比、不同频率下电路的热响应情况.
Combining EDA tools Cadence and a well established commercial simulation program based on finite element method ANSYS,this paper simulates the transient thermal effect of integrated circuit on layout-level. After obtaining electronic parameters especially power dissipation of the circuit,the transient temperature distribution is calculated by loading them into the thermal subsystem established by ANSYS. Based on a simple integrated circuit,we obtain the thermal time constant by adjusting the pulse-length,and simulate the thermal response under pulse with the same frequency and the same duty ratio but different duty ratio and different frequency.
出处
《微电子学与计算机》
CSCD
北大核心
2010年第5期74-77,共4页
Microelectronics & Computer
基金
北京工业大学校青年基金项目(X1002013200801)
北京工业大学博士启动基金项目(X0002013200802)
关键词
集成电路
瞬态热分析
芯片最高温升
脉冲占空比
integrated circuit
transient thermal analysis
the highest temperature rise
pulse duty ratio
