摘要
在微电子学、光学、材料科学诸领域广泛应用的薄层材料的导温系数常用周期热流法测量。在对测量原理和实验方法研究的过程中，提出用半导体制冷元件通以调制电流来实现周期加热，在薄型样品的不同点粘或压接热电偶来测量温度，由两点温度变化的相位差来确定导温系数。同时为克服热电偶接合的偶然因素引起误差而采用双向加热的补偿方法．实测了厚度为５０～２００μｍ的不锈钢和铜箔，取得良好结果。
Thin materials are extensively used in microelectronics, optics and material science. Their thermal diffusivity are usually measured by the periodic heat-flow. method. Studying on the principle and technique of experiment, this paper presents that thermoelectric module to which modulated electric current is input is used as a:periodic heat source and the thermal diffusivity is determined by the phase shift between both temperature signals with periodic variation. The temperature signals of two points are measured by thermocouples attached to the surface of the specimen by sticking or pressing. At the same time, two directional heating method is used to compensate the error caused by the random factor in attaching the thermocouples to the specimen. stainless steel and copper foils of thickness from 50 to 200μm were measured. The results are satisfactory.
出处
《清华大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
1990年第5期91-95,共5页
Journal of Tsinghua University(Science and Technology)
关键词
材料
导温系数
测量
热流法
thermal diffusivity, materials, measurements, heat-flow method
