摘要
用磁控溅射法在硅基材料上制备TaN薄膜,用原子力显微镜(AFM)和X射线衍射仪(XRD)研究不同工艺下磁控溅射TaN薄膜的表面形貌和组织,用纳米压痕仪和CHI电化学分析仪测试薄膜的力学性能和耐腐蚀性能。结果表明,基底加热和退火处理均导致TaN薄膜组织发生六方结构TaN(110)向面心立方结构TaN(111)和TaN(331)的转变。另外,基底加热和退火处理工艺均改善了TaN薄膜的显微硬度和膜基结合力等力学性能,其断裂韧性和耐腐蚀性能有所降低。
TaN thin film was fabricated on silicon substrate by magnetron sputtering method.The surface morphology and microstructure of TaN thin film under different processes were investigated by atomic force microscope and X-ray diffractometer.The mechanical properties and corrosion resistance property of TaN thin film were tested by nano indenter and CHI-electric-chemistry analyser.The results show that heating on substrate and annealing have significant effect on microstructure variation of TaN thin film from hexagonal structure TaN（110） to face-centered cubic structure TaN（111） and TaN（331）.Furthermore,the mechanical properties（microhardness,film-substrate cohesive force,etc） of TaN thin film are increased by above two heating processes.However,the fracture toughness and corrosion resistance of TaN thin film are decreased.
出处
《金属热处理》
CAS
CSCD
北大核心
2010年第4期47-51,共5页
Heat Treatment of Metals
基金
上海市科技发展基金(07ZZ159)
上海市重点学科建设项目(J51402)
上海工程技术大学创新基金(A0500E76308)
上海市教委创新项目(08YZ157)
上海市教委优青项目(GJD-07017)
关键词
TaN薄膜
表面形貌
力学性能
耐腐蚀性能
TaN thin film
surface morphology
mechanical property
corrosion resistance
