摘要
磁控溅射法是制备薄膜材料的重要手段,薄膜属性受其制备参数的制约,诸参数相互关联,共同影响薄膜的沉积、成核及生长。本文在简要介绍了磁控溅射制备薄膜的基本原理及基本流程的基础上,讨论了溅射参数影响薄膜属性的基本规律和作用机理,并简述了使用磁控溅射法制备薄膜的注意事项。
Magnetron sputtering is an important method for the fabrication of thin film. The physical and chemical properties of thin film are controlled by sputtering parameters, so it is essential to know the relationship between these properties and the sputtering parameters. In this paper, the basic theory of the sputtering magnetron was described, after which the relationship between properties of film and the sputtering parameters was discussed in detail, and then the concise reviews about flow of fabrication were presented.
出处
《贵州大学学报（自然科学版）》
2010年第1期62-66,共5页
Journal of Guizhou University:Natural Sciences
基金
国家自然科学基金(60566001
60766002)
科技部国际合作重点项目(2008DFA52210)
贵州省信息产业厅项目(0831)
贵阳市科技计划项目(2009筑科大合同字第6号)
关键词
磁控溅射
溅射参数
薄膜制备
退火处理
薄膜属性
magnetron sputtering
sputtering parameters
fabrication of thin film
annealing
properties of thin film
