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金属铜在铜(Ⅱ)氨溶液中的溶解行为 被引量:3

Dissolution Behavior of Copper in Cupric Ammine Solutions
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摘要 对铜在Cu(Ⅱ)-NH3-(NH4)2SO4-H2O体系中的溶解行为进行了研究,分析了影响铜溶解速率的因素。实验结果表明,溶液中初始铜离子浓度、氨和硫酸铵浓度、温度以及空气通入量均对铜的溶解速率有较大的影响。得到了较适宜的溶铜条件:温度50℃,初始铜离子和氨的浓度分别为1.0mol/L和7.5mol/L,硫酸铵浓度为0.5mol/L,同时通入适量的空气。 The dissolution behavior of copper in Cu (Ⅱ)-NH3-( NH4)2 SO4-H2O system was studied. The factors of affecting the dissolution rate of copper were analyzed. Experimental results showed that the dissolution rate of copper was influenced by initial concentration of cupric ion and ammonia, concentration of ammonium sulphate, temperature and amount of air entering the system. The suitable conditions of dissolving copper were given as follows : temperature at 50℃ ; initial concentration of cupric ion around 1.0mot/L; ammonia concentration around 7.5mol/L; concentration of ammonium sulphate around 0.5mol/L and air in appropriate amount.
出处 《上海有色金属》 CAS 2010年第1期1-4,共4页 Shanghai Nonferrous Metals
关键词 铜(Ⅱ)氨溶液 溶解 copper cupric ammine solution dissolution
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参考文献5

  • 1Hugo M V, Andrea M B, Jane Z F, et al. Recovery of Copper from Printed Circuit Boards Scrapes by Mechanical Processing and Electrometallurgy [J]. Journal of Hazardous Materials B, 2006, 37: 1704-1709.
  • 2William J H, Paul T W. Separation and Recovery of Materials from Scrap Printed Circuit Boards [ J]. Resources, Conservation and Recycling, 2007, 51: 691-709.
  • 3Oishi T, Koyama K, Alam S, et al. Recovery of High Purity Copper Cathode from Printed Circuit Boards Using Ammoniaeal Sulfate or Chloride Solutions [J]. Hydrometallurgy, 2007, 89 (1-2) : 82-88.
  • 4王吉位.铜的再生与利用在中国具有广阔的发展前景[J].中国资源综合利用,2005,23(1):6-9. 被引量:9
  • 5张淑琴.氨法浸取铜包钢制氯化亚铜[J].无机盐工业,1997,11(2):35-37. 被引量:7

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