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Electromechanical Behavior of Interdigitated SiO2 Cantilever Arrays

Electromechanical Behavior of Interdigitated SiO2 Cantilever Arrays
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摘要 Bending and first flexural mode vibration behavior of electrostatic actuated nanometer-sized interdigitated cantilever arrays are characterized under vacuum conditions. The pull-in'' effect in dc driving and the hard spring effect'' in ac driving are observed. A mass sensitivity of 20 fg is expected for our devices due to the ultra-small mass of the arm and relative high Q factor. The mass-spring lump model combined with Green's function method is used to fit the dc driving behaviors including the pull-in voltage. For the ac driving case, the polynomial expansion of the capacitive force is used in the model. The successfully fittings of the pull-in voltage and the hard spring effect prove that our simulation method could be used for guiding the geometrical design of cantilever-based sensors. Bending and first flexural mode vibration behavior of electrostatic actuated nanometer-sized interdigitated cantilever arrays are characterized under vacuum conditions. The pull-in'' effect in dc driving and the hard spring effect'' in ac driving are observed. A mass sensitivity of 20 fg is expected for our devices due to the ultra-small mass of the arm and relative high Q factor. The mass-spring lump model combined with Green's function method is used to fit the dc driving behaviors including the pull-in voltage. For the ac driving case, the polynomial expansion of the capacitive force is used in the model. The successfully fittings of the pull-in voltage and the hard spring effect prove that our simulation method could be used for guiding the geometrical design of cantilever-based sensors.
出处 《Chinese Physics Letters》 SCIE CAS CSCD 2010年第2期307-310,共4页 中国物理快报(英文版)
关键词 Electronics and devices Instrumentation and measurement Condensed matter: structural mechanical & thermal Nanoscale science and low-D systems Electronics and devices Instrumentation and measurement Condensed matter: structural, mechanical & thermal Nanoscale science and low-D systems
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