摘要
通过测量CuCl2–CuCl–NaCl–HCl溶液的氧化还原电位(ORP),研究了酸性蚀刻液在蚀刻过程与电化学再生过程中ORP与溶液组成和温度的关系。结果表明,酸性蚀刻液的ORP随Cu+离子质量浓度的增加而降低,且在Cu2+离子质量浓度较高或总Cu质量浓度变化不大时与Cu+离子质量浓度的对数成正比。酸性蚀刻液中的溶解氧、Cu2+离子、Cl?离子和H+离子的浓度以及温度对ORP的测量有一定影响,但最大误差不超过0.9%。溶液组成一定时,ORP与测量温度成正比。ORP的测量可以指示酸性蚀刻液的蚀刻速率及其电化学再生过程。
The oxidation reduction potential （ORP） of an acidic etching bath comprising CuCl2, CuCl, NaCl and HCl was measured, and its dependence on bath composition and temperature during etching and electrochemical regeneration processes was studied. The results showed that the ORP of acidic etching bath is decreased with increasing mass concentration of Cu＋, and is directly proportional to the logarithm of the mass concentration of Cu＋ when the mass concentration of Cu^2＋ is relatively high or when the mass concentration of total Cu varies slightly. The dissolved oxygen in acidic etching bath, as well as the concentration of Cu^2＋, Cl^- and H^＋, and temperature have certain impact on ORP measurement, but the maximum error is not more than 0.9%. The ORP is in direct proportion to temperature when the bath composition is unvaried. The measurement of ORP can indicate the etching velocity and electrochemical regeneration process in acidic etching bath.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2010年第2期14-18,共5页
Electroplating & Finishing
关键词
酸性铜蚀刻液
氧化还原电位
电化学氧化
再生
一价铜离子
acidic copper etching solution
oxidation reduction potential
electrochemical oxidation
regeneration
cuprous ion
