摘要
以甲基、苯基氯硅烷和1,4-二(羟基二甲基硅基)苯为原料,采用水解-缩聚法合成了主链含亚苯基的甲基苯基有机硅树脂,并对其结构和性能进行了研究。红外光谱(FT-IR)和核磁共振(29Si NMR)分析表明,亚苯基被成功引入到硅树脂主链中。差式量热扫描(DSC)分析表明硅树脂为均聚物。热失重(TG)结果表明,在N2氛中,硅树脂在450℃失重约1%,优于普通甲基苯基硅树脂。硅树脂的清漆涂层在300℃下使用时,附着力、抗冲击、柔韧性能仍保持良好。电化学阻抗分析(EIS)结果表明,硅树脂的清漆涂层常温固化后、经300℃的高温烘烤后都具有优良的耐腐蚀性能。
The silicone resin with silphenylene units was synthesized using hydrolysis-polycondensation method from 1, 4-Bis（hydroxydimethylsilyl） benzene （BHB） and phenyl and methyl chlorosilane. FT-IR and a9 Si NMR analysis proved that the silphenylene units have been incorporated into the polymer of silicone resin which indicated was homopoly- mer by DSC. The thermal properties were investigated using therrno-gravimetric analysis（TG）. The TG analysis indicated that this novel had good heat resistance with the onset degradation temperature at 350℃. The analyses of mechanical prop- erties indicated that the shock resistance, adhesion power and flexibility of varnish coating of silicone resin maintained ex- cellently when they were heated at the temperature of 300℃. The electrochemical impedance spectrum （EIS） analysis re- vealed that the varnish coating of silicone resin exhibit good corrosion resistance on the steel surface after cured under room temperature and heated at the temperature of 300℃.
出处
《化工新型材料》
CAS
CSCD
北大核心
2010年第1期49-51,54,共4页
New Chemical Materials
关键词
亚苯基
硅树脂
耐热性
电化学阻抗
silphenylene, silicone resin, heat resistance, electrochemical impedance spectrum
