摘要
用化学镀方法，制备了四元Ni－Cu－Sn－P非晶态合金镀层。详细研究了各种工艺参数，包括三种金属盐浓度、还原剂浓度、络合剂浓度、pH值以及温度对合金膜沉积速度和成分的影响。对这些影响的原因进行了讨论。
The quaternary amorphous Ni － Cu － Sn － P alloys were prepared by electroless plating. Theinfluence of technologic conditions including the concentration of metallic salts, reductant,complex agent, PH value and temperature on the dePOsition rate and concentration of dePOSitswere studied in detail.
出处
《长沙交通学院学报》
1998年第3期24-29,共6页
Journal of Changsha Communications University
关键词
化学镀
非晶态合金
工艺参数
electroless plating
amorphous Ni- Cu- Sn-P alloys
technologic conditions
